Anash.org feature: Dayan Levi Yitzchok Raskin, Rov of Anash in London, explores interesting Torah questions and halachic dilemmas including bentching on gluten-free matza, Chabad-style shevorim, making up Krias HaTorah the next day, and the hole size for a sealed doorway.
The following issues are discussed by Rabbi Raskin in this week’s episode:
Discussion about Makas Mardus consisting of 13 lashes.[1]
I have been advised to avoid gluten. Rakusens produce a gluten-free Matzo. The list of ingredients includes maize starch, oats, tapioca starch, and soya bran. Does this food warrant the full bentsching? [2]
Does the Tekiah have to be a straight, level sound?[3]
The Chabad-style Shevorim has an extra note added. Isn’t that an extraneous sound that would serve to interrupt between the Shevorim and the Tekiah that follows? [4]
The only area available for me to build a Sukkah is partially in the shade of a tree. How should I assess if it is permissible to build my Succah there? [5]
On Monday we had no Minyan for Shacharis. Is there a possibility to make up the missed Krias haTorah on Tuesday morning? [6]
We recently had a wall built where previously had been sliding partition doors. In accordance with Tzavo’as Reb Yehuda haChosid, we should make a hole through this new wall. The Previous Rebbe writes that this hole should measure 1½ tefochim. What is the basis for this size? [7]
A man had a tattoo on his upper left arm. He has now undergone a procedure to remove it, but for the short term, he has a bandage covering the area where the Tefilin are placed. Please advise whether he should put Tefilin over the bandage? With a brocho? [8]
I’m travelling and will have to leave the house before sunrise. Should I daven at home before sunrise, or in the airport after sunrise?[9]
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Discussion In keeping in line with the Rabbonim's policies for websites, we do not allow comments. However, our Rabbonim have approved of including input on articles of substance (Torah, history, memories etc.)
We appreciate your feedback. If you have any additional information to contribute to this article, it will be added below.